Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

Product Categories

Power Inductors [36]
Thermal Interface Materials [12]
FPGA IC [6]
Board to Board Connectors [14]
IC Chips [494]
Common Mode Chokes [38]
Ferrite Core Ring [6]
FPC Connectors [10]
USB Connectors [9]
EMC Components [13]
Electronic Components Connectors [23]
EMC Materials [12]
EMI EMC Testing [6]

ZSUN CHIPS CO., LTD

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

ZSUN CHIPS CO., LTD

Visit Website

City: Shenzhen

Province/State: Guangdong

Country/Region: China

View Contact Details

Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

Contact Now

Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad

Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The ...

Product Tags:

Silicone Free Thermal Interface Materials

Thermal Interface Materials Pad

Thermal Gap Filler Pad

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	ZSUN CHIPS CO., LTD
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Friendly Links: www.everychina.com